High-Quality & Flexibility
simultaneous transfer :13,000 UPH
YSB55w, a high-speed, high-accuracy flip-chip*1 bonder that achieves industry-leading productivity and high-accuracy bonding. This model will be released in December 2015.
The new YSB55w is a flip-chip bonder specially designed to bond flip-chips onto printed circuit boards, etc., with the flip-chips that are used in IT communications devices and digital appliances being manufactured in increasing numbers. It features a high-rigidity frame and dual bonding heads, and is fitted with a flip-chip recognition system employing a high-resolution camera. Developed to cater to a market increasingly focused on mass-production, Yamaha has realized the high accuracy demanded of the latest leading-edge flip-chips, almost tripling the bonding capacity of existing Yamaha models at 13,000 UPH*2 for flip-chips from wafer supply (under optimal conditions, includes processing time), and doubling the bonding accuracy at ±5um (3sigma).
1.Flip-chip: A type of semi-conductor integrated circuit (chip) that enables more compact and functionally-enhanced semi-conductor devices.
2.UPH (Units Per Hour): Total number of chips that can be bonded in one hour. Yamaha's existing model, the YSH20, operates at 4,500 UPH
Background to Development
Yamaha already has a track record of successfully applying its surface mount technology to the development and manufacture of bonders compatible with flip-chip and other semi-conductor packaging, and has a good reputation for superior bonding accuracy and versatility.
However, growth in the market and production scale for smartphones and wearable devices in recent years has seen even greater penetration of flip-chips, as they meet the more detailed process rules required to make the device modules used in these products smaller, thinner, more energy efficient and functionally superior. This uptake of flip-chips has in turn generated demand for greater bonding accuracy and productivity.
In order to respond to this kind of market demand, Yamaha has loaded the YSB55w with its latest technology and accumulated knowhow, to achieve almost triple the productivity and double the high-precision bonding accuracy of existing models. With the YSB55w, Yamaha aims to strengthen its position in the semiconductor manufacturing equipment industry.
Realizing high-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process
L260 × W200 - L50 × W50mm
0.2 - 3.0mm
PBC transport direction
Left to right (Option: right to left)
13,000 UPH (under optimal conditions, includes processing time)
±5?m (3?) (Guaranteed accuracy when using Yamaha standard components)
Component supply configuration
12 inch wafers
L2,090 × D1,866 × H1,550mm
Phone: +86 13691605420
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China